Power module

ABSTRACT

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. application Ser.No. 14/788,808, filed on Jul. 1, 2015, now allowed, which claims thepriority benefit of Taiwan application serial no. 103141432, filed onNov. 28, 2014. The entirety of each of the above-mentioned patentapplications is hereby incorporated by reference herein and made a partof this specification.

TECHNICAL FIELD

The disclosure relates to a power module, and more particularly to athree-dimensional power module having a heat dissipation assembly.

BACKGROUND

In response to the global developing trend toward automation and energysaving, it requires adoption of inverters and motors to satisfydifferent needs for rotational speeds. Traditional inverters includepower modules, driving board, control board, heat sink and passivecomponents, and peripheral electronic devices, which leads to invertersoversize and overweight.

High efficiency and high power density have always been the requirementsfor inverters in the industry. High efficiency means reduction in energyconsumption, which is beneficial for energy saving, emission reductionand environment protection while reducing costs. High power densitymeans small volume, light weight, reduced transportation costs andspatial needs, which thereby reduces costs in the construction; highpower density also means reduced use of materials, which is furtherbeneficial for energy saving, emission reduction and environmentprotection.

Semiconductor devices are one of the important factors in determiningthe efficiency of inverters. However, the use of semiconductor devicesinevitably needs to use heat dissipation device that help dissipate heatfrom semiconductors. These devices usually occupy a certain proportionin power converters. In general, current power modules are mostlycomposed of a planar structure or stacked on a plane of structure, andtherefore a planar heat dissipation device is needed.

However, in addition to requiring a large-area substrate for bearing thepower device, the heat dissipation of the power module also needs tohave the planar heat dissipation structure. Thus, it is not easy for thepower module to have more preferable space utilization, and it easilyleads to unfavorable combination between the substrate bearing the powermodule and the heat dissipation assembly, which affects the performanceand reliability of the power module in heat dissipation.

SUMMARY

A power module is provided, which enhances power density and heatdissipation perfonnances via a vertical structure.

The power module of the disclosure includes a plurality of substrates, aplurality of power devices, and a heat dissipation assembly. Thesubstrates are located on different planes and surround an axis, whereineach of the substrates extends along the axis. The power deviceselectrically connected with each other are disposed on the substratesrespectively. The heat dissipation assembly is disposed on thesubstrates and opposite to the power devices. Heat generated from thepower devices is transferred to the heat dissipation assembly throughthe substrates.

In order to make the aforementioned and other features and advantages ofthe disclosure comprehensible, several exemplary embodiments accompaniedby figures are described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide further understanding,and are incorporated in and constitute a part of this specification. Thedrawings illustrate exemplary embodiments and, together with thedescription, serve to explain the principles of the disclosure.

FIG. 1 is a top view of a power module according to an embodiment of thedisclosure.

FIG. 2 is a side view of the power module of FIG. 1.

FIGS. 3 and 4 respectively illustrate schematic diagrams of acombination of a power module with an electronic apparatus in differentembodiments.

FIG. 5 illustrates a schematic diagram of a combination of a powermodule with an electronic apparatus in another embodiment.

FIG. 6 illustrates an explosion diagram of a heat dissipation assemblyin a power module in another embodiment of the disclosure.

FIG. 7 illustrates a schematic diagram of the flow of a fluid in theheat dissipation assembly of FIG. 6.

FIG. 8 illustrates a schematic diagram of the flow of a fluid in a heatdissipation assembly in another embodiment of the disclosure.

FIG. 9 illustrates a schematic diagram of a portion of components of theheat dissipation assembly of FIG. 8.

FIG. 10 illustrates a schematic diagram of the flow of a fluid in a heatdissipation assembly in another embodiment of the disclosure.

FIG. 11 illustrates a schematic view of a power module in anotherembodiment of the disclosure.

DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS

FIG. 1 is a top view of a power module according to an embodiment of thedisclosure. FIG. 2 is a side view of the power module of FIG. 1.Referring to both FIGS. 1 and 2, in this embodiment, a power module 100is adapted for a variety of apparatus, such as being used in inverter ofa motor. The power module 100 includes a plurality of substrates 110, aplurality of power devices 120, at least one heat dissipation assembly130 and a plurality of connecting terminals 140, wherein the material ofthe substrates 110 is, for example, ceramics, and these substrates 110are located on different planes and surround an axis X1 while each ofthe substrates 110 extends along the axis X1. The power devices 120 arerespectively disposed on the substrates 110, which are, for example,secured on the substrates 110 by soldering, and the power devices 120are electrically connected to each other via conductive wires 150. Also,the power devices 120 disposed on different substrates 110 may also beelectrically connected to each other via the conductive wires 150, andrelevant circuit arrangements (not shown) may even be disposed on thesubstrates 110 to serve as means for electrically connecting differentpower devices 120.

Based on the above, in the power module of the disclosure, a columnarstructure is formed via the three-dimensional structure, that is, thesubstrates for bearing the power devices are located on different planesand surround an axis, so that the heat dissipation assembly is mountedin the columnar structure. This arrangement reduces the area occupied bythe power module due to the vertical structure, so as to be beneficialto installation and heat dissipation.

Furthermore, after the substrates 110 surround the axis X1 to form athree-dimensional structure, the heat dissipation assembly 130 isdisposed on the substrates 110 and opposite to the power devices 120, sothat the heat dissipation assembly 130 is located substantially in thestructure formed by the substrates 110. The substrates 110 are disposedon the heat dissipation assembly 130 by soldering. In this embodiment,the substrates 110 include a metal layer located above (i.e., where thepower devices 120 are disposed), an insulated layer located in themiddle and a metal layer located below (i.e., near the heat dissipationassembly 130), wherein the metal layers may be copper layers, and theinsulating layer may be made of ceramic materials such as aluminum oxideor aluminum nitride via manufacturing processes such as Direct BondCopper (DBC). However, the disclosure is not limited thereto.

On the other hand, the power module 100 of the disclosure furtherincludes a substrate interconnection structure 160. In this embodiment,the substrate interconnection structure 160 is, for example, a groupstructure of the conductive wires 150 and serves as electricalconnection between circuits on the substrates 110 respectively under thepremise that the substrates 110 have been soldered on the heatdissipation assembly 130. However, the form and number of the substrateinterconnection structure 160 is not limited herein. For instance, thesubstrate interconnection structure 160 may also be a metal wire, metalfoil, metal ribbon or metal bracket having a fixed shape and soldered onthe substrates 110, or conductive structures such as flexible printedcircuit board with conductive layer. In addition, after the power module100 is disposed, a module housing (not shown) may be mounted, wherein,for example, the power module 100 as shown in FIG. 1 is disposed in ahousing have a similar shape, and silicone is filled into the casing toprevent conductive lines 150 from contacting each other and protectingdevices in the module, so as to avoid damages caused by vibration.Thereby, in addition to providing electrical connection between thesubstrates 110, the substrate interconnection structure 160 is also ableto enhance the overall structural strength of the power module 100 andprotection effects thereof.

In the embodiment, a module is formed by the three substrates 110 shownin FIG. 1, that is, the electricity on the power module 100 flowsthrough the three substrates 110 (surrounding the axis X1) and thenflows out via the connecting terminals 140.

In another embodiment of the disclosure that is not shown, each of thesubstrates independently forms a module, that is, each of the threesubstrates 110 are independent in a structure similar to that shown inFIG. 1. In this situation, three pairs of connecting terminals 140 areserved as electrically conductive structures corresponding to each ofthe substrates 110, so as to adapt to each of the substrates 110operating independently and the power devices 120 thereon. Under such acircumstance, the conductive wires 150 are not required between each ofthe substrates 110 for electrical connection, but other structuralconnections may still serve as the connection between the substrates 110and the heat dissipation assembly 130.

The substrate interconnection structure 160 and the module casing aresimilarly applicable to other embodiments of the disclosure, anddescriptions are provided with the embodiment of FIGS. 1 and 2 as asample.

After the arrangements, the substrates 110 form an axisymmetricalcolumnar structure extending along the axis X1, so that the powerdevices 120 are substantially located on exposed surfaces of thecolumnar structure. Compared with current power devices assembled bystacking, in this embodiment, the user may easily assemble and repairthe power devices 120 because the power devices 120 are exposed.Furthermore, when the substrates 110 surround the axis X1 so that across-section contour of the substrates 110 is a closed contour (thecross-section takes the axis X1 as a normal) and the power devices 120are located outside the closed contour, the heat dissipation assembly130 is able to use the space inside the closed contour for installationwhile dissipating the heat from all of the power devices 120.

In other words, in the vertical columnar structure, the power devices120 between different substrates 110 are electrically connected to eachother traversely while the heat is dissipated in a direction vertical tothe substrate 110 and the power device 120. That is, the heat generatedfrom the power devices 120 located outside the closed contour istransferred to the heat dissipation assembly 130 inside the closedcontour through the substrates 110. The heat dissipation assembly 130 isable to dissipate the heat from all of the power devices 120 on thesubstrates 110 simultaneously, as shown in FIG. 1, so that the heatdissipation assembly 130 located in the closed contour is able todissipate the heat from the power devices 120 in three sidessimultaneously. Compared with current planar heat dissipation structures(as described above, disposing a plurality of power devices on the samesubstrate and further stacking the same on a plate-like heat dissipationmember for heat dissipation), the three-dimensional power module 100thereby has more heat dissipation performance.

In this embodiment, the power module 100 forms a closed triangularcontour for an inverter apparatus and is electrically connected to themotor body through the connecting terminals 140. However, the disclosureis not limited thereto. FIGS. 3 and 4 respectively illustrate schematicdiagrams of a combination of a power module with an electronic apparatusin different embodiments. As described in the above, since the powermodule 100 is a hollow and vertical columnar structure, its interiorspace can be used to integrate with relevant electronic apparatus. Asshown in FIG. 3, when an electronic apparatus 400 has a square contour,each of the substrates 110 and the power devices 120 of a power module200 are disposed on different surfaces of the electronic apparatus 400.Similarly, as shown in FIG. 4, when an electronic apparatus 500 (such asthe three-phase electric motor in the above) has a circular contour,each of the substrates 110 and power devices 120 of a power module 300are disposed on the electronic apparatus 500.

In addition, referring to FIGS. 1, 3 and 4, since the power module 100(200, 300) includes a plurality of substrates 110 (the number of whichis not limited herein), the power module 100 (200, 300) has a bendablestructural feature using the conductive wires 140 (or conductive copperfoils or the like that have flexible conductive structures) asconnecting media between adjacent substrates 110, so as to form anaxisymmetrical/spiral closed/open contour, thereby being adapted forelectronic apparatus having different shapes, as the polygon electronicapparatus 400 illustrated in FIG. 3 or the circular electronic apparatus500 illustrated in FIG. 4. Meanwhile, the conductive structure alsoadequately increases the number of the substrates 110 and the powerdevices 120 thereon, which thereby also enhances expandability of thepower module 100 (200, 300).

FIG. 5 illustrates a schematic diagram of a combination of a powermodule with an electronic apparatus in another embodiment. Referring toFIG. 5, when the power module of FIG. 1 forms the columnar structurehaving openings on both ends as shown in FIG. 5 and has an electronicapparatus (not shown) installed in the formed closed contour, a controlcircuit board 600 may be disposed at at least one end of the openings onboth ends so that the control circuit board 600 is electricallyconnected between the electronic apparatus and the power module 100 tocomplete system installation. Meanwhile, the shape of the controlcircuit board 600 matches the closed contour of the power module 100,which arrangement is also beneficial to the structure of the overallinstallation and provides utilization of space.

Below are specific descriptions of various heat dissipation manners.

FIG. 6 illustrates an explosion diagram of a heat dissipation assemblyin a power module in another embodiment of the disclosure. FIG. 7illustrates a schematic diagram of the flow of a fluid in the heatdissipation assembly of FIG. 6, wherein FIG. 7 illustrates a portion ofthe structure in FIG. 6 from a top view. Besides, the substrates 110 andthe power devices 120 could be referred to embodiments and figuresdescribed above. Solid-line arrows represent fluid status in a member132 while dotted lines represent the member, so as to clearly identifythe flowing status of the fluid. Referring to both FIGS. 6 and 7 andcompared with FIG. 1, as described above, since the substrates form aclosed contour having accommodation space, the heat dissipation assemblycan be disposed in the accommodation space so as to dissipate the heatfrom the power devices.

In FIGS. 6 and 7, a heat dissipation assembly 130 includes differentmembers 131 to 135, a main channel 136 and a plurality of branchchannels 137, wherein the main channel extends in the closed contouralong the axis X1 and has an inlet E1 and an outlet E2. The members 133to 135 correspond to the substrates 110 and are respectively disposed onone side of the substrates 110 opposite to the power devices 120, andthe members 131 and 132 are disposed between the members 133 to 135, sothat the main channel 136 and the branch channels 137 are adjoined.Positions of the inlet E1 and the outlet E2 of the main channel 136 arenot limited herein. In this embodiment, the substrates 110 are dividedinto two ends along the axis X1 while the inlet E1 and the outlet E2 arelocated on opposite ends. In another embodiment that is not shown, theinlet and the outlet may be located on the same end, so that the fluidflows in and out of the power module from the same side of thesubstrate.

Herein, the branch channels 137 are divided into 137A to 137I, whereinthe branch channels 137A to 137C are disposed in the member 131 andconnected to the inlet E1 of the main channel 136, the branch channels137D to 137F are disposed in the member 132 and connected to the outletE2 of the main channel 136, the branch channels 137G to 137I arerespectively disposed on the members 133 to 135 and each renders acurving path. Therein, the branch channel 137A is connected to an inletE3 of the branch channel 137G, the branch channel 137D is connected toan outlet E4 of the branch channel 137G, the branch channel 137B isconnected to an inlet E5 of the branch channel 137H, the branch channel137E is connected to an outlet E6 of the branch channel 137H, the branchchannel 137C is connected to an inlet E7 of the branch channel 137I, andthe branch channel 137F is connected to an outlet E8 of the branchchannel 137I. Accordingly, after the fluid flows from the inlet E1 ofthe main channel 136 into the heat dissipation assembly 130, the fluidsplits and flows to the branch channels 137G to 137I of differentmembers 133 to 135 through the branch channels 137A to 137C as shown bythe solid-line arrows in FIG. 7, so as to dissipate the heat in thecorresponding power devices 120 of the substrates 110 respectively.Then, the fluid converges and flows to the outlet E2 of the main channel136 through the branch channels 137D to 137F to flow out of the heatdissipation assembly 130, so as to achieve the effect of heatdissipation.

In another embodiment that is not shown, the branch channels 137G to137I located in the members 133 to 135 may also be formed directly onsurfaces of the substrates 110 opposite to the power devices 120, i.e.,inner surfaces of the closed contour. That means, the members 133 to 135are substantially integral with the corresponding substrates 110, whichthereby saves time and cost for manufacturing the power module.Furthermore, in yet another embodiment, the members 131 and 132 may alsobe non-physical structures which have the inlet E1, the outlet E2 andthe branch channels 137A to 137F of the main channel 136.

FIG. 8 illustrates a schematic diagram of the flow of a fluid in a heatdissipation assembly in another embodiment of the disclosure. FIG. 9illustrates a schematic diagram of a portion of components of the heatdissipation assembly of FIG. 8, and a member 138 illustrated herein issimilar to the member 133 in the above embodiment. Referring to bothFIGS. 8 and 9, different from the above embodiment, the channel of thisembodiment is designed to drive the fluid directly to the spot on thesubstrate 110 corresponding to the power device 120, wherein a branchchannel 137J is left-right symmetrically disposed on the member 138,that is, the branch channel 137J as shown in FIGS. 8 and 9 are in ajuxtaposed and end-to-end path. Therefore, a fluid F1 flowing in from aninlet E1 a directly flows to the back side of the substrate 110corresponding to the power device 120 after split-flow, and the heatdissipation path of the fluid is shortened due to a plurality ofjuxtaposed structures of the branch channel 137J, so as to achieve moreheat dissipation effects. Finally, a fluid F2 flowing out of the member138 and then flowing out after being converged at an outlet E2 a.

In addition, FIG. 10 illustrates a schematic diagram of the flow of afluid in a heat dissipation assembly in another embodiment of thedisclosure. Different from the above, a fluid F3 flowing in from aninlet E1 b is directly sprayed on the spot on the substrate 110corresponding to the power device 120 in a manner of jet or impingementflow after split-flow, that is, the branch channels located on themembers 133 to 135 in the previous embodiment is replaced with the wholesurface of the substrate 110 opposite to the power device 120 in thisembodiment. Similarity lies in that after the fluid flows through thesurface of the substrate 110 opposite to the power device 120, areturning flow F4 is converged and flows out of the heat dissipationassembly of the power module through an outlet E2 b.

FIG. 11 illustrates a schematic view of a power module in anotherembodiment of the disclosure. Referring to FIG. 11, in the power module700 of the embodiment, the heat dissipation assembly 130 includes aplurality of heat dissipation fins 710 extending in the closed contourfrom each of the substrates 110 away from the power devices 120.Furthermore, the heat dissipation assembly 130 further includes a fan720 (a dotted-line contour in FIG. 11) disposed on at least one openingon ends of the columnar structured formed by the substrates 110, so thatcooling air flows through the heat dissipation fins 710 for heatdissipation.

In view of the above, in the embodiments of the disclosure, the powermodule forms a columnar structure by the substrates being arrangedsurrounding an axis, so that the heat dissipation assembly or theelectronic apparatus adaptable to the power module is disposed in theclosed contour formed by the substrates. Therefore, compared withconventional power modules formed by stacking, the power module of thedisclosure effectively enhances space utilization and reduces the areaoccupied thereby. Furthermore, the heat dissipation assembly located inthe columnar structure and extending along the axis is thereby able todissipate the heat from the power devices on the substrates since theheat dissipation assembly is able to serve the plurality of substrates.Therefore, compared with the conventional power modules formed bystacking that is not able to dissipate the heat separately, the powermodule of the disclosure effectively enhances heat dissipationefficiency and is not easily affected by deformation of materials.

Although the disclosure has been described with reference to the aboveembodiments, it will be apparent to one of ordinary skill in the artthat modifications to the described embodiments may be made withoutdeparting from the spirit of the disclosure. Accordingly, the scope ofthe disclosure will be defined by the attached claims and not by theabove detailed descriptions.

What is claimed is:
 1. A power module, comprising: a plurality ofsubstrates, located on different planes and surrounding an axis, whereineach of the substrates extends along the axis; a plurality of powerdevices, disposed on the substrates respectively and electricallyconnected with each other; and a heat dissipation assembly, disposed onthe substrates and opposite to the power devices, wherein the heatdissipation assembly comprises a plurality of heat dissipation finsextending from each of the substrates away from the power devices,wherein an extending length of the heat dissipation fins graduallyincreases from two sides of each of the substrates towards the middle ofeach of the substrates, and heat generated from the power devices istransferred to the heat dissipation assembly through the substrates. 2.The power module as recited in claim 1, wherein the substrates surroundthe axis to form a closed contour, the power devices are located outsidethe closed contour, and the heat dissipation assembly is located insidethe closed contour.
 3. The power module as recited in claim 2, whereinthe closed contour is a polygon.
 4. The power module as recited in claim2, wherein the substrates form a columnar structure having openings onboth ends, and the closed contour is a cross-section contour of thecolumnar structure.
 5. The power module as recited in claim 2, whereinan electronic apparatus is adapted for being disposed on the closedcontour.
 6. The power module as recited in claim 1, wherein thesubstrates are symmetrical with respect to the axis.
 7. The power moduleas recited in claim 1, wherein each of the substrates is divided intotwo ends along the axis, and the heat dissipation assembly furthercomprises a fan that is disposed on at least one end of the substrates.8. The power module as recited in claim 1, wherein the substrates areelectrically connected by a substrate interconnection structure.
 9. Thepower module as recited in claim 8, wherein the substrateinterconnection structure is a metal wire.
 10. The power module asrecited in claim 8, wherein the substrate interconnection structure is aflexible printed circuit board.